Paper and presentation at DPC iMAPS 2020

GaNonCMOS partner AT&S submitted a paper and held a presentation on “PCB embedding of Magnetic Material for Inductor-based Applications” at iMAPS’ 16th Annual Device Packaging Conference (DPC 2020) held in Fountain Hills, Arizona, on March 2-5, 2020.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.

The presentation and paper are available for download! 

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